Shin Puu Technology Co., Ltd. Company Logo Shin Puu Technology Co., Ltd.

Semiconductor Testing and Testing Equipment PCB

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Quick Information

  • Place of Origin: Taiwan

Description

Technologies

●Aspect ratio up to 25
●Big size board assembly
●Board flatness <0.3%
●Board thickness 9.1 mm
●Embedded component PCB
●High speed and low loss materials
●Layer count up to 40
●Minimum line width / spacing 2 mil
●VIP (via in pad) :
  conductive-conductive copper paste ;
  non-conductive-epoxy via hole fill

Applications
Burn-in, load board and probe Card


Product Image

  • Semiconductor Testing and Testing Equipment PCB image

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Shin Puu Technology Co., Ltd.
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