Shin Puu Technology Co., Ltd. Company Logo Shin Puu Technology Co., Ltd.

IC Design Application PCB

Contact Now* Send an Inquiry to this supplier.
or
Start Order * Name your price

Quick Information

  • Place of Origin: Taiwan

Description

Technologies

●Any layer HDI
●Aspect ratio up to 25
●Back drill
●Board thickness 10 mm / 390 mil
●Cavity down
●High speed and low loss materials
●Layer count up to 40
●Micro via copper-fill plate
●Minimum line width / spacing 2 mil (50 micro meters)
●Thermal management-coin inserted
●VIP (via in pad) :
  conductive-conductive copper paste ;
  non-conductive-epoxy via hole fill

Applications
Smart Phones, Internet of Things, Multimedia A/V, Telecommunication Equipment, Sensing Component, Smart TV, DVD/Blu-ray Storage System, Smart Audio System, Home Networking Device System, Smart CPU&GPU, Broadband Gateway and Set-top Box, Tablet, LTE Modem Platform, RF Transceiver, NFC( Near Field Communication) Product, Bluetooth Product, GPS (Global Positioning System) Product, Wireless Charging and Wearable Device.


Product Image

  • IC Design Application PCB image

Send an Inquiry to this supplier

Send an Inquiry to this supplier
* From
  To Christina Pai
Shin Puu Technology Co., Ltd.
* Buying Product
- Please enter your specific buying item.
e.g. 42 inch LCD TV, leather executive chair
Category : Rigid PCB
* Message

Use English only Max. 2000 characters. (Min. 20)

Send
EC21.com does not guarantee the validity of product information or the credentials of sellers.

Browse: Manufacturer Directory Premium Suppliers Site Map

About EC21 Contact Us Terms & Conditions Report Item Online Trading Risks Product Listing Policy

Copyright (c)1997-2026 EC21 Inc. All Rights Reserved. EC21 in KoreanChinese

Business Registry Number: 120-86-03931 | Mall order sales Registration Number: 강남-5838